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http://umt-ir.umt.edu.my:8080/handle/123456789/7093| Title: | A STUDY OF UNDERFILL MORPHOLOGY AND FILLER CONTENT USING SCANNING ELECTRON MICROSCOPY AND THERMOGRAVIMETRIC ANALYZER |
| Authors: | I.AHMAD Z.ENDUT A.ZAHARIM NOOR AZHAM MOHD SUKEMI |
| Keywords: | Flip chip underfill filler content morphology SEM TGA |
| Issue Date: | 2007 |
| Publisher: | Journal of Sustainability Science and Management |
| Abstract: | The filter content of two type capillary underfill materials for flip chip packaging were studied using Thermo gravimetric Analyzer (TGA) and Scanning Electron Microscopy (SEM). An epoxy based resin and cyanate ester based resin were subjected to TGA to determine the percentage of filler content and theirs morphology were studied using SEM. The result showed that these two underfills materials have a very similar percentage of filler content which is around 70% and shows a good morphology properties for capillary underfill application |
| URI: | http://hdl.handle.net/123456789/7093 |
| Appears in Collections: | Journal Articles |
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