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Development of cookies by using pumpkin flour

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dc.contributor.author Nurdalina Haszwani Mohd Razali
dc.date.accessioned 2018-05-22T05:34:22Z
dc.date.available 2018-05-22T05:34:22Z
dc.date.issued 2007
dc.identifier.uri http://umt-ir.umt.edu.my:8080/xmlui/handle/123456789/9054
dc.description.abstract This study reported on the effects of incorporating different level of pumpkin flour (0-50 %) and different types of pumpkin flour on the physicochemical and sensory properties of cookies. Three types of pumpkin flour were used which are whole pumpkin flour (WH), pumpkin flour without rind (W) and pumpkin flour with rind (S). It was found that fiber and moisture content influence the hardness of cookies. Fracturability result shows the decreasing value instead of the increasing level of pumpkin flour incorporation. L * value of control cookies were higher than pumpkin cookies. For a* value, there was increase as the level of pumpkin flour incorporation is increase. W cookies and WH cookies show the decreasing trend while S cookies shows increasing trend of b* values. Proximate analysis was carried out on four cookies samples which are control cookies, 20 % W cookies, 20 % S cookies and 20 % WH cookies. The results of proximate analysis showed the formulated cookies that were incorporated with pumpkin flour contained more ash, protein, fiber and fat compared to control cookies. However, 20 % WH cookies contained more ash, fiber and fat compared with 20 % W cookies and 20 % S cookies. For the protein content, 20 % W cookies shows the highest value compared to other cookies samples. Besides that, sensory evaluations for the cookies were carried out. From the evaluation, result indicated that 10 % W cookies and 10 % S cookies have the highest acceptability among the panelists. en_US
dc.language.iso en en_US
dc.publisher Terengganu: Universiti Malaysia Terengganu en_US
dc.subject LP 54 FASM 3 2007 en_US
dc.subject Nurdalina Haszwani Mohd Razali en_US
dc.title Development of cookies by using pumpkin flour en_US
dc.type Working Paper en_US


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